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The main modes of failure of thin film capacitors are as follows

1. Strong electric field breakdown: When the electric field strength exceeds the limit that thin film capacitors can withstand, it will cause electric field breakdown, leading to the failure of thin film capacitors. This failure mode may be caused by factors such as high voltage, voltage fluctuations, or overvoltage.

2. Dielectric aging: The dielectric material of thin film capacitors may age over time, losing its original performance. For example, environmental factors such as high temperature, high humidity, and ultraviolet radiation may cause aging of capacitor media, leading to failure

3. Temperature stress: Thin film capacitors may be affected by temperature stress in high or low temperature environments, causing deformation or stress concentration in the internal structure of the capacitor, leading to failure.

4. Humidity stress: Membrane capacitors may be subjected to the effect of humidity stress in high humidity environments, leading to individual water absorption expansion or internal structural changes of the capacitor, resulting in failure.

5. Mechanical stress: Thin film capacitors may be subjected to external mechanical stress, such as vibration, impact, etc., which can cause damage to the internal structure of the capacitor and result in failure. The above are just a few common modes and reasons for the failure of thin film capacitors, and the actual situation may also be affected by other factors. For circuit design and application using thin film capacitors, it is necessary to consider these failure modes and causes to improve the reliability of the capacitor.